Silicon on insulator

• Semiconductor technology (19)

  • SIMOX
  • Semiconductors
  • Smart Cut
  • AAL1gator
  • Etching (microfabrication)
  • Etching (microfabrication)
  • FTDI
  • LOCOS
  • Luxtera
  • Nemotek Technologie
  • Optical beam-induced currents
  • Proximity communication
  • Scattering rate
  • Technology aware design
  • Thermal management of high-power LEDs
  • Thermal oxidation
  • Wafer-level Packaging
  • Wafer-level optics
  • Wire drawing
  • Xelerated
  • more...

• Semiconductors (104)

  • Bandgap
  • Compound semiconductor
  • Dopants
  • Floating body effect
  • Gate dielectric
  • Gate dielectric
  • Heterojunction
  • Hole mobility
  • IEDM
  • Low-k
  • Metal gate
  • Semiconductor device
  • Semiconductor device fabrication
  • Semiconductor devices
  • Semiconductor material
  • Semiconductor materials
  • Solid State Devices
  • Strained silicon
  • Thin film transistors
  • Acceptor (semiconductors)
  • Airgap
  • Anderson's rule
  • Anomalous photovoltaic effect
  • Band diagram
  • Band offset
  • Cadmium oxide
  • Carbon nanofoam
  • Carrier lifetime
  • Charge carriers in semiconductors
  • Compound semiconductors
  • Conduction band
  • Current crowding
  • Current injection technique
  • Degenerate semiconductor
  • Depletion region
  • Die shrink
  • Diffusion capacitance
  • Direct and indirect band gaps
  • Donor (semiconductors)
  • Electronic band structure
  • Equivalent oxide thickness
  • Etch pit density
  • Extrinsic semiconductor
  • Field-effect transistor (FET operation)
  • Haynes - Shockley experiment
  • Homojunction
  • Hot carriers injection
  • Hot electron
  • Impact ionization
  • International Technology Roadmap for Semiconductors
  • International Technology Roadmap for Semiconductors lithography nodes
  • Intrinsic semiconductor
  • Isobutylgermane
  • Isotropic etching
  • Lattice constant
  • Light-emitting diodes
  • Luttinger parameter
  • Luxtera
  • Metal-induced gap states
  • Metal-semiconductor junction
  • Metalorganics
  • Moisture Sensitivity Level
  • Multi-site test
  • N-type semiconductor
  • Narrow gap semiconductor
  • Negative bias temperature instability
  • Negative luminescence
  • Nemotek Technologie
  • On-die termination
  • Overdrive voltage
  • P-i-n and n-i-p
  • P-n junction isolation
  • P-type semiconductor
  • Photo-Dember
  • Proximity communication
  • QBD (electronics)
  • Quantum heterostructure
  • Random logic
  • Reliability (semiconductor)
  • Reverse leakage current
  • Roll-to-roll processing
  • SILC (semiconductors)
  • Schottky barrier
  • Semiconductor analysis
  • Semiconductor carrier mobility
  • Semiconductor companies
  • Semiconductor journals
  • Semiconductor physicists
  • SensorDynamics
  • Sheet resistance
  • Silicate glass
  • Strain engineering
  • Thermal copper pillar bump
  • Transmission line measurement
  • Trimethylgallium
  • Trimethylindium
  • Valence band
  • Velocity overshoot
  • Velocity saturation
  • Voltage reference
  • Wide bandgap semiconductors
  • ZnO based Diluted Magnetic Semiconductors
  • austriamicrosystems
  • k·p perturbation theory
  • p–n junction
  • more...

• Microtechnology

  • Bulk micromachining
  • Optical lithography
  • Smart Cut
  • Semiconductor device fabrication

• Electronic engineering

  • High-k
  • ULSI
  • Semiconductors
  • Semiconductor device fabrication

• Condensed matter physics

  • Doped
  • Photonic crystal
  • Semiconductors
  • Hole mobility
  • Bandgap

• Silicon

  • Porous silicon
  • SiGe
  • Strained silicon

• Semiconductor materials

  • Silicon germanium
  • Polycrystalline silicon
  • Germanium
  • AlGaN
  • Strained silicon
  • Silicon
  • Porous silicon

• Semiconductor device fabrication (9)

  • Silicon on sapphire
  • Silicon wafer
  • Epitaxy
  • Process technology
  • Focused ion beam
  • Focused ion beam
  • Semiconductor industry
  • SIMOX
  • Smart Cut
  • Doped
  • more...

• Silicon compounds

  • Silicon oxide
  • Silicide
  • Silicon nitride
  • Silicon germanium

• Integrated circuits

  • BCDMOS
  • Complementary Metal Oxide Semiconductor
  • Rad-hard
  • Semiconductor memory
  • Integrated circuit
  • Silicon germanium
  • ULSI

• International Technology Roadmap for Semiconductors lithography nodes (17)

  • 32nm
  • 45nm
  • 65 nanometer
  • 90 nanometer
  • 1 µm process
  • 1 µm process
  • 1.5 µm process
  • 10 µm process
  • 11 nanometer
  • 130 nanometer
  • 16 nanometer
  • 180 nanometer
  • 22 nanometer
  • 250 nanometer
  • 3 µm process
  • 350 nanometer
  • 600 nanometer
  • 800 nanometer
  • more...

• Computer memory

  • Memory controller
  • Z RAM
  • L1 cache
  • Computer data storage
  • Soft error
  • Twin Transistor RAM
  • Semiconductor memory

• Transistor types (41)

  • Bipolar transistors
  • Field effect transistor
  • Finfet
  • Floating gate
  • SOI MOSFET
  • SOI MOSFET
  • Alloy-junction transistor
  • Avalanche transistor
  • Ballistic transistor
  • Chemical field-effect transistor
  • Darlington transistor
  • Diffusion transistor
  • Drift-field transistor
  • EOSFET
  • FREDFET
  • Floating Gate MOSFET
  • Grown-junction transistor
  • Heterojunction bipolar transistor
  • Heterostru- cture-emitter bipolar transistor
  • High Electron Mobility Transistor
  • ISFET
  • ITFET
  • Induced high electron mobility transistor
  • Insulated-gate bipolar transistor
  • JFET
  • MESFET
  • MISFET
  • MODFET
  • MOSFET
  • Native transistor
  • Oxide thin film transistor
  • Pentode transistor
  • Point-contact transistor
  • Power MOSFET
  • Self-aligned gate
  • Spacistor
  • Spin transistor
  • Surface-barrier transistor
  • Tetrode transistor
  • Thin film transistors
  • Unijunction transistor
  • VMOS
  • more...

• Thin film deposition (38)

  • Molecular beam epitaxy
  • Atomic layer deposition
  • Atomic layer epitaxy
  • Cathodic arc deposition
  • Chemical beam epitaxy
  • Chemical beam epitaxy
  • Chemical vapor deposition
  • Conformal film
  • Diamond-like carbon
  • Electron beam physical vapor deposition
  • Electrostatic spray assisted vapour deposition
  • Epitaxy
  • Evaporation
  • Evaporation (deposition)
  • Focused ion beam
  • Hull cell
  • Hybrid Physical-Chemical Vapor Deposition
  • Ion beam
  • Ion beam assisted deposition
  • Ion beam deposition
  • Ion plating
  • Kinetic Monte Carlo surface growth method
  • List of coating techniques
  • Metal plating
  • Metalorganic vapour phase epitaxy
  • Physical vapor deposition
  • Plating
  • Pulsed laser deposition
  • Silicon on sapphire
  • Sol-gel
  • Spin coating
  • Sputter cleaning
  • Sputter deposition
  • Thermal barrier coating
  • Thermal spraying
  • Tinning
  • Trimethylgallium
  • Trimethylindium
  • Vacuum deposition
  • more...

• Logic families (30)

  • Bicmos
  • NMOS logic
  • PMOS logic
  • Cascode Voltage Switch Logic
  • Complementary Metal Oxide Semiconductor
  • Complementary Metal Oxide Semiconductor
  • Complementary Pass-transistor Logic
  • Current mode logic
  • Depletion-load NMOS logic
  • Differential TTL
  • Differential signaling (High-voltage differential signaling)
  • Diode logic
  • Diode–transistor logic
  • Direct-coupled transistor logic
  • Domino logic
  • Dynamic logic (digital logic)
  • Dynamic logic (digital logic) (Static versus dynamic logic)
  • Emitter-coupled logic
  • Four-phase logic
  • Gunning Transceiver Logic
  • Integrated injection logic
  • LVCMOS
  • Logic family
  • Low-voltage differential signaling
  • Low-voltage positive emitter-coupled logic
  • Multi-threshold CMOS
  • PCMOS
  • Philips NORbits
  • Positive emitter-coupled logic
  • Resistor–transistor logic
  • Transistor- –transistor logic
  • more...

• Foundry semiconductor companies (11)

  • Chartered Semiconductor Manufacturing
  • GLOBALFOUNDRIES
  • Tsmc
  • Foundry model
  • Hejian Technology Corporation
  • Hejian Technology Corporation
  • Hindustan Semiconductor Manufacturing Company
  • Jazz Semiconductor
  • SSMC
  • Semiconductor Manufacturing International Corporation
  • United Microelectronics Corporation
  • X-Fab
  • more...

• Computer hardware

  • Strained silicon directly on insulator
  • Unbuffered memory
  • Central processing unit
  • Twin Transistor RAM

• See also (20)

  • Soitec
  • Thermal insulation
  • Dielectrics
  • Electrical insulator
  • PRTV
  • PRTV
  • Transistors
  • Bernin
  • Pin grid array
  • Hypertransport
  • Cissoid
  • Gate oxide
  • Appl. Phys. Lett.
  • Journal of applied physics
  • Chemical elements
  • Intel TeraHertz
  • Silicon photonics
  • Transistor count
  • AMD Athlon 64 FX
  • Silicon rubber
  • PC1600
  • more...

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